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Latest News:
EquipIC supply chain and SystematIC Design Announce European Partnership for Advanced Mixed Signal ASIC Realization:
Download Press Release (PDF Download, 120kb)
EquipIC supply chain, LLC Teams with Perceptia Devices Inc. for Advanced Mixed Signal ASIC Designs:
Download Press Release (PDF Download, 120kb)
EquipIC supply chain attended GSA Semiconductor Ecosystem Summit, October 2011, at the Santa Clara Convention Center.
EquipIC supply chain attended the SAME Conference, Sofia Antipolis, France, October 2012.
EquipIC supply chain attended the SB-Micro “Chip on the Cliffs” Microelectronics Conference and Exhibition, Joao Pessoa, Brazil, August 2011.
Equip IC Supply Chain attended Design Automation Conference, San Diego, June 2011.
EquipIC supply chain attended ESC in San Jose, May 2011.
Come visit EquipIC supply chain attended ChipEX 2011 in Tel Aviv, Israel, May 2011.
EquipIC attended the Applied Power Electronics Conference in Ft. Worth, Texas, March 2011.
EquipIC attended Design Con 2011, Santa Clara, February 2011.
Turnkey ASIC Services for Fabless Semiconductor Companies and ‘System Houses’
IC Assembly & Test
Assembly & Test Services:
EquipIC supply chain provides test, sort, reliability tests, assembly and bumping services.
We will take care of all the needed validation and the full range of quality assurance activity to enable a smooth transition through production of first samples to successful and cost-effective high-volume production. This includes yield optimization, corner lot characterization, test time optimization and reliability tests.
Salland Engineering, Giga Solution Tech and NRFLab are our preferred test houses, experienced in developing test programs and testing our customers’ ASICs.
Our recommended methodology is to develop the test programs by professional test houses close to the design team. Test programs are validated and optimized by testing the initial production lots in the test house. Later on, when test time and yield stabilize, the test programs are ported to the foundry and to the package house for mass production.
Unisem, UTAC, AMKOR, ASE and other assembly houses are our selected partners for packaging our customers’ ICs. We are able to offer QFP, QFN and BGA bonding type packaging as well as bumping and Flip-Chip technologies.
Bulk Wafer Services:
EquipIC can provide the following wafer services:
- wafer backgrind
- gold bumping
- solder bump
- RDL design
Assembly / Test Partners: